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Global Locations
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- High-density and Miniaturized SMT Manufacturing Process
- In-line SPI (Solder Paste Inspection) & (AOI) Automated Optical Inspection
- Under-fill process & SAT (Scanning Acoustic Tomography)
- In-line AXI (Auto. X-ray inspection) & CT X-ray analysis
- Flux cleaning process
- In-line solder paste dispensing process
- Selective mold / Step mold / Chamfer mold / Film mold process
- Laser combine process (Laser marking + Laser trench)
- Compartment and conformal shielding process
- Combine singulation process (Laser cutting + Saw)
- Package grounding process
- Die bond process
- Wire bond process
- Wafer grinding process
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