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Universal Scientific Industrial

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  • High-density and Miniaturized SMT Manufacturing Process
  • In-line SPI (Solder Paste Inspection) & (AOI) Automated Optical Inspection
  • Under-fill process & SAT (Scanning Acoustic Tomography)
  • In-line AXI (Auto. X-ray inspection) & CT X-ray analysis
  • Flux cleaning process
  • In-line solder paste dispensing process
  • Selective mold / Step mold / Chamfer mold / Film mold process
  • Laser combine process (Laser marking + Laser trench)
  • Compartment and conformal shielding process
  • Combine singulation process (Laser cutting + Saw)
  • Package grounding process
  • Die bond process
  • Wire bond process
  • Wafer grinding process
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    ISO 9001, TL 9000, ANSI/ESD S20.20, ISO 14064-1, IECQ QC080000
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